To establish a territorial hub for respective regions in Printed Intelligence by integrating research, education, manufacturing, and commercialization; enabling the country to lead the transition from Education 5.0 to Industry 5.0 through future-ready knowledge systems and deep-tech innovation.

Introduction

i4 Technologies is poised to launch a national initiative within the deep tech disruptive electronics industry, aiming to build a robust indigenous ecosystem with global relevance. The mission is to position and integrate the intellectual property of Education 5.0 as a pioneering effort, serving as a catalyst for cross-border operations by leveraging collective business and knowledge in Printed Intelligence, also known as Printed Flexible Electronics (PFE).

Defining Printed Intelligence

“Printed Intelligence”refers to the transfer of knowledge from printed electronics technology to product designers, with the potential to create significant impacts. Currently, industrial designers have limited exposure to this emerging technology. Increasing awareness among student designers is essential to unlock opportunities that enhance future product design, offering flexible form factors beyond the limitations of rigid circuit boards. A dedicated knowledge framework is necessary to educate student designers and facilitate understanding of this disruptive technology.

Scope and Applications

Printed Intelligence is an interdisciplinary field that merges materials science, electronics, and additive manufacturing. It enables the production of low-cost, flexible, and sustainable electronic products. Applications span healthcare, wearables, sensors, packaging, smart devices, medical devices, defence, aerospace, automotive displays, energy storage, organic photovoltaics (OPV), advertising, lighting, optical systems, surveillance, sensors (temperature, pressure, water, cosmetics), wearable devices, biotechnology, pharmaceuticals and advanced battery technology. Printed Flexible Electronics is positioned to revolutionize electronics and manufacturing sectors.

Educational Framework

To nurture innovation and expertise in PFE, this white paper proposes a multi-tiered educational framework encompassing schools, colleges, universities, and research institutions. The framework focuses on curriculum development, infrastructural support, faculty training, and industry collaboration. It aligns with respective national initiatives for empowering and imparting the skill sets for multifarious sectors.

Taxonomy for Educational Innovation

Translating concepts from other fields into a taxonomy for educational innovation has previously benefited industrial and engineering designers by enhancing cross-disciplinary understanding. The overarching goal of transitioning from Education 5.0 to Industry 5.0 is to establish a printed electronics taxonomy, which will serve as a foundation for educating student designers and improving future product design outcomes.

Mission Objectives

Given the urgency and potential impact, this initiative seeks to address the needs of both corporate and government sectors. The mission is to position Printed Intelligence as a futuristic knowledge capital transitioning from Education 5.0 to Industry 5.0 by implementing a unique business intelligence framework.

Sincerely,

Dr. Umer Salim

To establish an Indian Eco System for Printed Intelligence by integrating research, education, manufacturing, and commercialization; enabling the country to lead the transition from Education 5.0 to Industry 5.0 through future-ready knowledge systems and deep-tech innovation.

• Build a national ecosystem for Printed Electronics (PE) research, design, manufacturing, and commercialization.
• Develop India’s first Printed Intelligence Taxonomy for education, skilling, and industry adoption.
• Enable global partnerships and cross-border collaboration in next-generation electronics.
• Align with national programs such as NEP 2020, Skill India, Atmanirbhar Bharat, Make in India, Digital India, and the National Semiconductor Mission.
• Support startups, MSMEs, corporate R&D, and government innovation through structured policy and technical frameworks.

An institute of national importance in India is in the verge to establish a national initiative ecosystem in the deep tech disruptive electronics industry indigenously on a global spectrum .This initiative seeks to position and integrate the global intellectual property of Education 5.0 within our Nation as a first mover, and to serve as a catalyst for cross-border global operations through our collective business and knowledge-intelligence of Printed Intelligence, aka : Printed Flexible Electronics (PFE).

“Printed Intelligence”: defines the knowledge transfer of printed electronics technology to the designers of products that have the potential to make a significant impact. There is a perceived lack of exposure to this emerging technology among industrial designers. It is desirable for student designers to be made aware of the opportunities such technology affords in order to enhance the design of future products. It offers a diverse range of new flexible form factors, no longer constrained by a rigid circuit board. In order to understand this disruptive emerging technology, a knowledge framework is required to support the education of student designers.

Printed Intelligence is an emerging interdisciplinary field that integrates materials science, electronics, and additive manufacturing to enable low-cost, flexible, and sustainable electronic products. With applications spanning from healthcare, wearables, sensors, packaging, and smart devices medical devices, defence applications, aerospace and automotive displays, energy storage, organic photovoltaics (OPV), advertising, lighting, optical systems, surveillance, sensors (temperature, pressure, water, cosmetics), wearable devices, biotechnology, pharmaceuticals and advanced battery technology., PFE is poised to revolutionize India’s electronics and manufacturing sectors.

To develop a robust ecosystem for PFE education and innovation, this white paper proposes a multi-tiered educational framework encompassing school, college, university, and research levels. The framework emphasizes curriculum development, infrastructure creation, faculty training, and industry collaboration, aligned with National Education Policy (NEP) 2020, Digital India, Skill India, and Make in India initiatives.

The translation of other fields into a taxonomy then utilised for educational innovations has previously proved successful within the context of Industrial Designers and Engineering Designers understanding the respective language of their disciplines. The overall goal of this Education 5.0 transitioned to Industry 5.0 is to create a printed electronics taxonomy that can be used to educate student designers and enhance future product design outcomes.
Given the urgency and potential impact of this initiative, we have to formulate the bylaw for the effective realization of this deep-tech, emerging technology venture. Our goal is to effectively address the needs of both corporate and government sectors and to make India a global leader in transitioning from Education 5.0 to Industry 5.0 through our unique knowledge intelligence framework.

Appreciate the respective bodies in the state to share their thoughts to structure the hierarchy and the protocol to be followed to formulate the national and state mission team wherein the core committee from the institute of national importance will be the principal members in the national mission ecosystem.

Sincerely,

Dr. Umer Salim

Pillar 1: National Printed Intelligence Education Framework
• School Level: Introductory modules, science exhibitions, micro-projects on flexible electronics.
• College Level: Skill-development courses, diploma programs and project-based learning.
• University Level: Bachelor/Masters specializations, interdisciplinary labs, industry internships.
• Research Level: Centers of Excellence (CoEs), doctoral programs and advanced fabrication facilities.
• Output: A unified, NEP-aligned curriculum and India’s first PE taxonomy.

Pillar 2: Infrastructure & Innovation Hubs
1. National Centers of Excellence (NCoEs) in Printed Intelligence
2. Regional Printed Electronics Labs (North/South/East/West)
3. Printed Intelligence Testbeds & Pilot Manufacturing Lines
4. Incubation and Startup Acceleration Centres for PE-based products
5. National Printed Components Repository for components, materials and prototyping.
Pillar 3: Industry & Government Integration

• Establish an Industry Advisory Council with representatives from electronics, textiles, healthcare, automotive, and consumer goods sectors.
• Facilitate technology transfer agreements, PPPs, and joint R&D programs.
• Build government adoption pathways for smart packaging, sensors, defence communication systems and healthcare devices.
• Enable certification and standardization in partnership with BIS, MeitY, and DPIIT.

Pillar 4: Global Alliances & Market Expansion,

• Build international partnerships (Finland, Japan, Germany, US, South Korea, Taiwan).
• Establish the Global Printed Intelligence Alliance (GPIA) led by India.
• Promote India as a preferred destination for PE manufacturing and design outsourcing.
• Host annual Global Printed Intelligence Summit in India.

Pillar 5: Knowledge-Intelligence & IP Development

• Create a National Printed Intelligence Knowledge Grid:
.Taxonomies
.Research libraries
.Design frameworks
.Best practices

• Launch IP acceleration programs to promote patents, publications, and indigenous materials/processes.
• Build a national digital hub for training, simulation, remote labs, and collaborative design.

A. Governing Council

• Chairperson: Nationally appointed scientific / technical leader
• Members: Ministry officials (MeitY, MoE, MSME, MoST, MHA, MoD,MESD), industry leaders, and academic experts
• Role: Policy direction, funding approval, and global coordination

---

B. NPIM Executive Secretariat (Core Team)

A dedicated operational team responsible for:

• Mission orchestration
• Partnerships & MoUs
• Curriculum strategy
• Funding mobilization
• Global outreach and representation

---

C. Technical Working Groups (TWGs)

1. Materials & Substrates
2. Flexible / Hybrid Electronics
3. Sensors & Embedded Systems
4. Additive Manufacturing Processes
5. Packaging & Sustainability

---

D. Education & Skilling Committee

• Curriculum designers
• University partners
• Training partners (NSDC, Sector Skill Councils)

Phase 1 : Foundation

Establish NPIM Secretariat

Form Governing Council & TWGs

Draft PE taxonomy

Identify host institutions for NCoEs

Create industry consortium

Launch awareness & capacity-building programs

---

Phase 2 : Expansion

1. Set up CoEs, Labs, and pilot lines
2. Deploy education programs across 100 institutions
3. Launch first set of indigenous PE components
4. Set up national repository
5. Start global partnerships and international outreach

---

Phase 3 : Consolidation

• Build manufacturing clusters
• Support 200+ startups under NPIM
• Deploy technologies for public sector use
• Achieve global leadership benchmarks
• Host global conferences and export-ready programs

• Private Public Partnership
• Cross-border Collaborative Funding
• International grants and global alliances
• Cross-border R&D Support & Corporate CSR
• Central & State government Grants
• State government partnership funds
• SPV Projects Funding
• VC/Investment Houses/HNI

Flexible & Printed Electronics is a set of advanced printing methods used to create electronics on a wide range of substrates.

These technologies use printing processes such as:

• Screen printing
• Flexography
• Gravure
• Offset lithography
• Inkjet printing

These processes deposit electrically functional inks to form devices like:

• Thin-film transistors
• Capacitors
• Coils
• Resistors
• Sensors

Flexible printed electronics enable low-cost, scalable, lightweight, and energy-efficient devices, including many everyday products such as:

• Smartphone and TV displays
• OLED lighting
• Touchscreens
• RFID tags
• Credit/debit cards
• Biomedical sensors
• Active clothing
• Diagnostic devices

Key application areas include:

• Printed semiconductors
• Energy-saving flexible lighting
• Curved and high-definition displays
• Printed biosensors & lab-on-chip systems
• Active & passive RFID
• 3D printed circuits
• Printed batteries
• Flexible solar photovoltaic panels
• Healthcare, wearables, sensors, packaging, and smart devices medical devices, defence applications, aerospace and automotive displays, energy storage, organic photovoltaics (OPV), advertising, lighting, optical systems, surveillance, sensors (temperature, pressure, water, cosmetics), wearable devices, biotechnology, pharmaceuticals and advanced battery technology

The global market for flexible printed electronics is projected to reach trillion-dollar scale by 2040.

Why this matters:
Printed electronics offer clean, energy-efficient manufacturing, relying on printing rather than large component factories.

i4 Technologies aims to become a regional leader in:

1. Skilling & Training ,Education & Talent Development
   Creating an innovation-ready workforce in Flexible Printed Electronics.
2. Innovation Across Key Sectors
   Including:
   • Defence
   • Space
   • Transportation
   • Infrastructure
   • Industrial & consumer electronics
   • Organic photovoltaics
   • Biomedical technologies
3. Applied and Contract R&D
   Cutting-edge research in printed electronics and smart materials.
4. Pilot Manufacturing
   Pilot-scale production & multi-technology prototype development.

• India becomes a global leader in Printed Intelligence.
• A new knowledge-driven electronics ecosystem enabling Industry 5.0.
• A highly skilled workforce across education levels.
• Strong indigenous manufacturing of flexible and printed electronics.

i4 Technologies’ strategic roadmap outlines a Printed Intelligence (PI) Ecosystem designed to help India accelerate toward a developed economy.

This ecosystem supports:

• Skilling
• Research & Development (R&D)
• Prototyping
• Pilot manufacturing
• Technology transfer
• International collaboration
• Entrepreneurship
• Industry 5.0–aligned smart manufacturing

Developed in partnership with National Institute of Importance in India, the Skill Mismatch Scheme (SMS) addresses the demand–supply gap in deep-tech talent.

It integrates:

• Academic skilling
• Experiential learning
• Applied research
• Manufacturing enablement
• Cross-border collaboration (EU & global partners)

This “concept-to-commercialization” model accelerates India’s Make in India mission in Printed Intelligence and Industry 5.0 verticals.

At its core is the proposed Printed Intelligence Skill University (PISU) — a 100-acre world-class campus with:

• Multidisciplinary laboratories
• PoC → prototype → pilot production pathways
• OEM/ODM industry integration
• Offshore/onshore manufacturing partners
• Integrated Accelerator & Incubation Center (IAIC)
• Facilities for foreign & domestic stakeholders

PISU will host Centers of Excellence (CoEs) in critical domains, including:

• Printronics / Flextronics for Defence & Home Affairs
• Medical Technologies
• Automotive & Electric Vehicles
• Energy Storage & Clean Energy
• Lighting & Displays
• Communication & Space Technologies
• Additional emerging printed electronics sectors

Each CoE will deliver:

• Scalable workforce development
• Cost-effective localization of international technology
• New-generation innovation for domestic & global markets

All education & training programs follow:

• Outcome-based education (OBE)
• CBCS (Choice-Based Credit System)
• Hands-on experiential learning

Aligned with:

• National Skill Development Corporation (NSDC)
• National Skills Qualifications Framework (NSQF)
• University Grants Commission (UGC)
• All India Council for Technical Education (AICTE)
• European modular certifications

i4 Technologies co-develops proprietary, modular curricula with train-the-trainer models for national scaling.

PISU through i4Technologies implements a hub-and-spoke industrialization model, enabling:

• Localized manufacturing ecosystems
• Technology spillover to affiliated industries
• Industrial franchise models (India & global)
• EU certification pathways for export readiness
• University-level and vocational-level adaptability

All content and models will be developed under a IP hub framework jointly owned by:

i4 Technologies
Respective Stakeholders in the IP Eco System globally

This ownership structure is suitable for corporate, academic, and international audiences.

Inclusive Innovation Circular Economy for Printed Intelligence—a concept that brings together sustainability, advanced manufacturing, and social impact:

1. What is Printed Intelligence?

Printed intelligence refers to manufacturing electronic components such as sensors, circuits, batteries, and displays using printing technologies including inkjet, screen, or roll-to-roll printing.

It enables

• Light weight, flexible electronics
• Low-cost mass production
• Less space consumption
• Use of functional inks (organic, metallic, nano-materials)

2. How Circular Economy Principles Apply

A circular economy aims to reduce waste and keep materials in use for as long as possible. For printed intelligence, this includes the following approaches:

Design for Recyclability

• Electronics printed on paper, bioplastics, or compostable substrates
• Use of non-toxic conductive inks
• Modular printed components that can be easily separated

Closed-Loop Manufacturing

• Recovering metals and conductive materials from printed electronics
• Reuse of substrates where feasible
• Reducing factory waste through additive manufacturing

Low-Carbon Material Choices

• Organic semiconductors
• Bio-based polymers
• Water-based inks

3. What Makes the Innovation Inclusive?

Inclusivity ensures that the innovation benefits people across different demographics, regions, and socioeconomic levels.

Access

• Open-access design tools for printed electronics
• Affordable printed devices for health monitoring, education, and environmental sensing

Local Manufacturing

• Distributed small-scale production hubs using roll-to-roll printers
• Job creation in rural and underserved regions

Co-design with Communities

• Low-cost diagnostic tools
• Smart packaging to reduce food waste
• Environmental sensors for air and water quality

Workforce Inclusion

• Training programs for women, youth, and displaced workers
• Low technical barriers due to simplified digital fabrication

4. Why This Combination Matters

• Sustainable production: Printed electronics consume fewer materials than traditional silicon-based processes.
• Democratized innovation: Community labs, small companies, and universities can produce advanced devices.
• Environmental benefits: Reduced electronic waste, biodegradable electronics, and circular material flows.
• Social empowerment: Local manufacturing and low-cost devices create new opportunities for underserved populations.

5. Example Applications

Healthcare

• Disposable biosensors printed on paper
• Affordable diagnostic strips

Environment

• Printed sensors for soil, water, and air monitoring
• Smart labels that enable waste reduction

Smart Packaging

• Temperature or freshness indicators
• Compostable electronics to reduce landfill impact

Education

• Low-cost printed circuit kits for classrooms
• Maker-friendly DIY electronics